Part Number Hot Search : 
271952B 9299010 UTX120 B3NK60Z MAX170 B160N75 SMZJ3796 MBR10
Product Description
Full Text Search
 

To Download IRF5M3205 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 PD - 94292A
HEXFET(R) POWER MOSFET THRU-HOLE (TO-254AA)
IRF5M3205 55V, N-CHANNEL
Product Summary
Part Number
IRF5M3205 BVDSS
55V
RDS(on) 0.015
ID 35A*
Fifth Generation HEXFET(R) power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. These devices are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits.
TO-254AA
Features:
n n n n n n n
Low RDS(on) Avalanche Energy Ratings Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed Light Weight
Absolute Maximum Ratings
Parameter
ID @ VGS = 10V, TC = 25C ID @ VGS = 10V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight * Current is limited by package For footnotes refer to the last page 35* 35* 140 125 1.0 20 475 35 12.5 2.6 -55 to 150 300 (0.063in./1.6mm from case for 10s) 9.3 (Typical)
Units A
W
W/C
V mJ A mJ V/ns
o
C
g
www.irf.com
1
08/28/01
IRF5M3205
Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage BV DSS/T J Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current
Min
55 -- -- 2.0 34 -- -- -- -- -- -- -- -- -- -- -- --
Typ Max Units
-- 0.056 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 6.8 -- -- 0.015 4.0 -- 25 250 100 -100 170 32 74 22 80 70 55 -- V V/C V S( ) A
Test Conditions
VGS = 0V, ID = 250A Reference to 25C, ID = 1.0mA VGS = 10V, ID = 35A VDS = VGS, ID = 250A VDS =15V, IDS = 35A VDS = 55V ,VGS=0V VDS = 44V, VGS = 0V, TJ =125C VGS =-20V VGS = -20V VGS =10V, ID = 35A VDS = 44V VDD = 28V, ID = 35A, VGS = 10V, RG = 2.5
IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance
nA nC
ns
nH
l Ciss C oss C rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
3600 1200 445
-- -- --
pF
Measured from drain lead (6mm / 0.25in. from package ) to source lead (6mm/0.25in. from pacakge VGS = 0V, VDS = 25V f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr QRR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- 35* 140 1.3 130 410
Test Conditions
A
V ns nC Tj = 25C, IS = 35A, VGS = 0V Tj = 25C, IF = 35A, di/dt 100A/s VDD 25V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
* Current is limited by package
Thermal Resistance
Parameter
RthJC Junction-to-Case
Min Typ Max Units
-- -- 1.0
C/W
Test Conditions
Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page
2
www.irf.com
IRF5M3205
1000
I D , Drain-to-Source Current (A)
100
I D , Drain-to-Source Current (A)
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP
1000
100
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP
4.5V
10
4.5V
10
1 0.1
20s PULSE WIDTH T = 25 C
J 1 10 100
1 0.1
20s PULSE WIDTH T = 150 C
J 1 10 100
VDS , Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000
2.0
R DS(on) , Drain-to-Source On Resistance (Normalized)
ID = 35A
I D , Drain-to-Source Current (A)
1.5
TJ = 25 C TJ = 150 C
100
1.0
0.5
10 4.0
15
V DS = 25V 20s PULSE WIDTH 7.0 5.0 6.0 8.0
0.0 -60 -40 -20
VGS = 10V
0 20 40 60 80 100 120 140 160
VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature( C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
www.irf.com
3
IRF5M3205
7500
VGS , Gate-to-Source Voltage (V)
6000
VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd
20
ID = 35A
16
VDS = 44V VDS = 27V VDS = 11V
C, Capacitance (pF)
4500
Ciss
12
3000
C oss C rss
8
1500
4
0 1 10 100
0 0 50
FOR TEST CIRCUIT SEE FIGURE 13
150 100 200
VDS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
1000
1000 OPERATION IN THIS AREA LIMITED BY R DS(on)
ISD, Reverse Drain Current (A)
100 T J = 150C 10 T J = 25C 1 VGS = 0V 0.1 0.0 0.5 1.0 1.5 2.0 2.5 VSD, Source-toDrain Voltage (V)
ID, Drain-to-Source Current (A)
100
100s
10 Tc = 25C Tj = 150C Single Pulse 1 1 10 VDS , Drain-toSource Voltage (V)
1ms
10ms
100
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
4
www.irf.com
IRF5M3205
80
LIMITED BY PACKAGE
VGS
60
V DS
RD
D.U.T.
+
I D , Drain Current (A)
RG
-V DD
VGS
40
Pulse Width 1 s Duty Factor 0.1 %
20
Fig 10a. Switching Time Test Circuit
VDS 90%
0 25 50 75 100 125 150
TC , Case Temperature ( C)
10% VGS
td(on) tr t d(off) tf
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 10b. Switching Time Waveforms
10
Thermal Response (Z thJC )
1 D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01
SINGLE PULSE (THERMAL RESPONSE) 0.0001 0.001 0.01
0.01 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.1 1
PDM t1 t2
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
5
IRF5M3205
1200
EAS , Single Pulse Avalanche Energy (mJ)
1 5V
1000
ID 15.7A 22A BOTTOM 35A TOP
VD S
L
D R IV E R
800
RG
D .U .T.
IA S
600
+ V - DD
A
VGS 20V
tp
400
0 .0 1
200
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D S S tp
0 25 50 75 100 125 150
Starting T , Junction Temperature( C) J
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
50K 12V .2F .3F
QG
10V
QGS VG QGD
VGS
3mA
D.U.T.
+ V - DS
IG
ID
Charge
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
6
www.irf.com
IRF5M3205
Footnotes:
Repetitive Rating; Pulse width limited by
maximum junction temperature. VDD = 25 V, Starting TJ = 25C, L= 0.8 mH Peak IAS = 35A, VGS =10V, RG= 25
ISD 35A, di/dt 230 A/s, Pulse width 300 s; Duty Cycle 2%
VDD 55V, TJ 150C
Case Outline and Dimensions -- TO-254AA
0.12 [.005]
.1 2 ( .0 0 5 ) 3 .7 8 ( .14 9 ) 3 .5 3 ( .13 9 ) -A 1 3 .8 4 ( .5 4 5 ) 1 3 .5 9 ( .5 3 5 ) 6 .6 0 ( .2 6 0 ) 6 .3 2 ( .2 4 9 ) -B 1 .2 7 ( .0 5 0 ) 1 .0 2 ( .0 4 0 )
3.78 [.149] 3.53 [.139] A
13.84 [.545] 13.59 [.535]
6.60 [.260] 6.32 [.249]
1.27 [.050] 1.02 [.040]
17 .4 0 ( .6 8 5 ) 16 .8 9 ( .6 6 5 ) 3 1 .4 0 ( 1.2 3 5 ) 3 0 .3 9 ( 1.1 9 9 )
2 0 .3 2 ( .8 0 0 ) 2 0 .0 7 ( .7 9 0 )
1 3 .8 4 ( .5 4 5 ) 1 3 .5 9 ( .5 3 5 )
22.73 [.895] 21.21 [.835]
LEGEND 1 - C O LL 2 - E M IT 3 - G A TE
17.40 [.685] 16.89 [.665] 1 2 3
20.32 [.800] 20.07 [.790]
13.84 [.545] 13.59 [.535]
B R 1.52 [.060]
1
2
3 -C -
4.82 [.190] 3.81 [.150]
1 .1 4 ( .0 4 5 ) 0 .8 9 ( .0 3 5 ) .50 ( .0 2 0 ) .25 ( .0 1 0 ) M C AM B MC
4.06 [.160] 3.56 [.140] 3X 1.14 [.045] 0.89 [.035] 0.36 [.014] B A
3.81 [.150]
3 .8 1 ( .1 5 0 )
3X 3 .8 1 ( .1 5 0 ) 2X
2X
LEGEND 1- DRAIN 2- SOURCE 3- GATE IRHM57163SED IRHM57163SEU
CAUTION BERYLLIA WARNING PER MIL-PRF-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing beryllium.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 08/01
www.irf.com
7


▲Up To Search▲   

 
Price & Availability of IRF5M3205

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X